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NTMFS4120N
Power MOSFET
30 V, 31 A, Single N ? Channel,
SO ? 8 Flat Lead
Features
? Low R DS(on)
? Optimized Gate Charge
? Low Inductance SO ? 8 Package
? These are Pb ? Free Devices
Applications
? Notebooks, Graphics Cards
? DC ? DC Converters
? Synchronous Rectification
V (BR)DSS
30 V
http://onsemi.com
R DS(on) Typ
3.5 m W @ 10 V
4.2 m W @ 4.5 V
D
I D Max
(Note 1)
31 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
$ 20
V
V
G
Continuous Drain Current
(Note 1 )
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
18
13
A
S
t v 10 s
T A = 25 ° C
31
Power Dissipation
(Note 1)
Steady
State
t v 10 s
T A = 25 ° C
P D
2.2
6.9
W
MARKING
DIAGRAM
D
T A = 85 ° C
Continuous Drain Current
(Note 2)
Power Dissipation (Note 2)
Pulsed Drain Current
T A = 25 ° C
Steady
State
T A = 25 ° C
t p = 10 m s
I D
P D
I DM
11
8.0
0.9
94
A
W
A
1
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
S
S
S
G
4120N
AYWZZ
D
D
D
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(V DD = 30 V, V GS = 10 V, I PK = 30 A,
L = 1 mH, R G = 25 W )
T J , T stg
I S
E AS
? 55 to
150
7.0
450
° C
A
mJ
4120N
A
Y
W
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
Lead Temperature for Soldering Purposes T L
(1/8 ″ from case for 10 s)
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol
260
Value
° C
Unit
ORDERING INFORMATION
Device Package Shipping ?
Junction ? to ? Case ? Steady State
Junction ? to ? Ambient ? Steady State (Note 1)
Junction ? to ? Ambient ? t v 10 s (Note 1)
R q JC
R q JA
R q JA
1.7
55.8
18
° C/W
NTMFS4120NT1G
NTMFS4120NT3G
SO ? 8 FL
(Pb ? Free)
SO ? 8 FL
(Pb ? Free)
1500 Tape & Reel
5000 Tape & Reel
Junction ? to ? Ambient ? Steady State (Note 2) R q JA 139.1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 1.0 in sq).
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 4
1
Publication Order Number:
NTMFS4120N/D
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